DA14695-00000HQ2

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DA14695-00000HQ2

IC RF TXRX+MCU BLE 86VFBGA

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  • Mfr. Partie #DA14695-00000HQ2
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  • Fiche de données
  • En stock21085

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Spécifications

Series SmartBond™
Part Status Active
Type TxRx + MCU
RF Family/Standard Bluetooth
Protocol Bluetooth v5.2
Frequency 2.4GHz
Power - Output 6dBm
Sensitivity -97dBm
Serial Interfaces GPIO, I2C, I2S, SPI, UART
Voltage - Supply 2.4V ~ 4.75V
Mounting Type Surface Mount
Package / Case 86-VFBGA
Supplier Device Package 86-VFBGA (6x6)
Base Product Number DA14695
DigiKey Programmable Not Verified
GPIO 20

Vue d'ensemble

Description

The DA14695-00000HQ2 is a highly integrated System on Chip (SoC) from Dialog Semiconductor, designed for Bluetooth Low Energy (BLE) applications. It features a 32-bit ARM Cortex-M4 processor with a floating-point unit, which provides efficient processing capabilities for embedded systems. The chip supports Bluetooth 5.0, enabling enhanced data rates and extended range, making it suitable for IoT applications.
Key features include multiple GPIOs, ADCs, DACs, PWM timers, and an extensive range of peripherals for interfacing with sensors and other devices. The DA14695 also incorporates a rich security framework, supporting secure boot and data encryption, which is crucial for connected applications.
It typically comes with a comprehensive software development kit (SDK) that includes libraries, example projects, and tools to facilitate rapid development. The SoC is ideal for a variety of applications, including wearables, smart home devices, and health monitoring systems, providing developers with a versatile platform for innovative product design.

Features

The DA14695-00000HQ2 is a Bluetooth System-on-Chip (SoC) from Dialog Semiconductor, designed for low-power applications. Key features include:
1. Bluetooth 5.0: Supports long-range and high-speed data transfer.
2. Ultra-Low Power: Optimized for battery-operated devices, enabling extended operational life.
3. Dual-core Architecture: Features a Cortex-M33 application processor and a Cortex-M0 for efficient task management.
4. Integrated Flash and RAM: Up to 512KB of flash memory and 128KB of RAM, allowing for complex applications.
5. Rich Peripherals: Includes GPIOs, ADCs, PWM, SPI, I2C, and UART for versatile connectivity options.
6. Security Features: Hardware security features like Secure Boot and Trusted Execution Environment (TEE) ensure data protection.
7. Development Support: Compatible with various development tools, including Dialog's SmartBond development kits.
The DA14695 is ideal for wearables, smart home devices, and IoT applications, combining performance with energy efficiency.

Package

The DA14695-00000HQ2 is packaged in a QFN (Quad Flat No-lead) package type, specifically a 7x7 mm size. This compact package is designed for efficient thermal performance and reduced board space in embedded applications.

Pinout

The DA14695-00000HQ2 is a member of the Dialog Semiconductor DA14695 family, which is a highly integrated System-on-Chip (SoC) designed for low-power Bluetooth applications. It features a pin count of 48 pins in a QFN package.
Key functions of the DA14695 include:
1. Bluetooth Connectivity: Supports Bluetooth 5.0 for low-energy wireless communication.
2. Microcontroller: ARM Cortex-M33 core for general-purpose processing tasks.
3. Memory: Integrated flash memory and RAM for code and data storage.
4. Analog Interfaces: Includes ADCs, DACs, and other analog peripherals for sensor interfacing.
5. Digital Interfaces: Support for SPI, I2C, UART, and GPIO for communication with external devices.
6. Power Management: Features for managing power consumption, enabling use in battery-operated devices.
This SoC is optimized for compact designs requiring efficient power usage, making it suitable for wearables, smart home devices, and other IoT applications.

Manufacturer

The manufacturer of the DA14695-00000HQ2 is Dialog Semiconductor, which is now a part of Renesas Electronics Corporation. Dialog Semiconductor is a global company that specializes in creating highly integrated power management, audio, and Bluetooth Low Energy (BLE) solutions. Established in 1981 and headquartered in London, Dialog focuses on providing innovative semiconductor products for various applications, including mobile devices, smart home products, and wearable technology. Their products are designed to enhance energy efficiency and connectivity in a wide range of electronic devices.

Application

The DA14695-00000HQ2 is a versatile System-on-Chip (SoC) primarily used in applications such as Bluetooth Low Energy (BLE) devices, wearables, smart home products, healthcare monitoring devices, and industrial automation. Its energy-efficient architecture and integrated features make it suitable for IoT applications, enabling seamless wireless communication and long battery life.

Equivalent

The DA14695-00000HQ2 is a part of Dialog Semiconductor's DA1469x series of Bluetooth Low Energy SoCs. Equivalent products include the DA14691 and DA14681 chips, which also offer similar features and capabilities in low-power Bluetooth applications. For a more comprehensive comparison, consider product specifications regarding processing power, memory, and peripheral support. Always verify compatibility based on specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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