DA14531-00000FX2

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DA14531-00000FX2

BLE 5.1 SOC WITH ARM CORTEX M0+

  • Fabricant
  • Mfr. Partie #DA14531-00000FX2
  • Paquet 24-WFQFN,FC
  • Fiche de données
  • En stock6979

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Spécifications

Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
Type TxRx + MCU
RFFamily/Standard Bluetooth
Protocol Bluetooth v5.1
Frequency 2.4GHz
Power-Output 2.5dBm
Sensitivity -94dBm
MemorySize 48kB RAM, 144kB ROM
SerialInterfaces ADC, GPIO, I²C, SPI, UART
GPIO 12
Voltage-Supply 1.1V ~ 3.3V
Current-Receiving 2.2mA
Current-Transmitting 3.5mA
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 24-WFQFN, FC

Vue d'ensemble

Description

The DA14531-00000FX2 is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) designed by Dialog Semiconductor, now part of Renesas Electronics. It is part of the DA14531 series, also known as the SmartBond TINY family, which focuses on ultra-low power, small size, and cost-effective BLE solutions. The DA14531 is tailored for various IoT applications, including beacons, wearables, connected medical devices, and more.
Key features of the DA14531-00000FX2 include:
1. Compact Design: It is one of the smallest and most power-efficient BLE solutions available, ideal for space-constrained applications.
2. Low Power Consumption: Designed for extended battery life, it supports applications requiring minimal energy.
3. Ease of Use: It offers a simplified software development process with the SmartSnippets™ software suite, reducing time to market.
4. Connectivity: Supports Bluetooth 5.1 features, providing robust and reliable wireless communication.
5. Versatility: The chip supports a variety of peripherals and interfaces, enhancing its flexibility in different applications.
Overall, the DA14531-00000FX2 is a versatile BLE solution for developers seeking efficient and cost-effective wireless connectivity for their IoT devices.

Features

The DA14531-00000FX2, commonly referred to as the SmartBond TINY module, is a highly integrated Bluetooth Low Energy (BLE) solution designed by Dialog Semiconductor (now part of Renesas Electronics). It is engineered to reduce the cost and complexity of adding BLE connectivity to a wide range of products.
Key features of the DA14531-00000FX2 include:
1. Ultra-Low Power Consumption: Optimized for minimal energy usage, making it suitable for battery-powered devices.

2. Small Form Factor: The compact module design (measuring 2.0 x 1.7 mm) allows for easy integration into space-constrained applications.
3. BLE 5.1 Support: Offers the latest in Bluetooth technology, including extended range and improved data transfer capabilities.
4. Integrated Processor: Equipped with an ARM Cortex-M0+ processor running at 16 MHz, providing adequate processing power for various applications.
5. Peripheral Interfaces: Includes multiple interfaces like UART, SPI, I2C, and GPIOs for versatile connectivity options.
6. Development Tools: Supported by a comprehensive suite of development tools, facilitating rapid prototyping and deployment.
Overall, the DA14531-00000FX2 is ideal for low-cost, energy-efficient BLE applications in consumer electronics, healthcare, and IoT devices.

Package

The DA14531-00000FX2 is typically available in a WLCSP (Wafer Level Chip Scale Package) format. This package type is compact and ideal for space-constrained applications, offering high performance and efficient power consumption.

Pinout

The DA14531-00000FX2 is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) from Dialog Semiconductor, known for its low power consumption and small form factor. It comes in a WLCSP (Wafer Level Chip Scale Package) with a pin count of 17.
The functions of the DA14531-00000FX2 include:
1. Bluetooth Connectivity: Provides BLE 5.1 connectivity, supporting features like extended advertising and improved data rates.
2. Processing: It is powered by an ARM Cortex-M0+ processor, suitable for various applications in IoT, health, fitness, and smart home devices.
3. Peripheral Interfaces: Offers several interfaces such as SPI, I2C, UART, PWM, and GPIOs, allowing connection with various sensors and external components.
4. Power Management: Designed for ultra-low power operation, making it ideal for battery-operated devices.
5. Memory: Includes embedded memory for storing firmware and cache.
This chip is used in applications requiring compact size, low energy consumption, and efficient wireless communication, like wearables and beacons.

Manufacturer

The DA14531-00000FX2 is manufactured by Dialog Semiconductor. Dialog Semiconductor is a company that specializes in the design and production of semiconductors for a variety of applications, including power management, audio, Bluetooth low energy, and other mixed-signal integrated circuits. The company is known for providing solutions primarily for the mobile, consumer electronics, and automotive markets. Dialog Semiconductor emphasizes energy-efficient technologies and has been a significant player in the development of Bluetooth low energy solutions, which are critical for IoT applications. In 2021, Dialog Semiconductor was acquired by Renesas Electronics, a major Japanese semiconductor manufacturer, which further expanded its capabilities and market reach.

Application

The DA14531-00000FX2, a Bluetooth Low Energy (BLE) microcontroller, is ideal for applications requiring low power consumption and wireless connectivity. Key areas include wearable devices, health and fitness trackers, smart home products, beacons, wireless sensors, and remote controls. It is also suitable for IoT devices where energy efficiency and compact size are critical, such as asset tracking, smart lighting, and connected health applications. Its low-cost and small footprint make it a great choice for innovative consumer electronics and industrial applications.

Equivalent

The DA14531-00000FX2 is a Bluetooth Low Energy (BLE) microcontroller from Dialog Semiconductor, part of Renesas. Equivalent products include Nordic Semiconductor's nRF52810, nRF52832, Texas Instruments' CC2640R2F, and Silicon Labs' EFR32BG22. These chips offer similar BLE functionalities, low power consumption, and are used in IoT applications and wearable devices. When choosing an equivalent, consider factors like power specifications, price, and specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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