C3D20060D

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C3D20060D

DIODE ARRAY SCHOTTKY 600V TO247

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Spécifications

Package Tube
Series Z-Rec®
ProductStatus Active
DiodeConfiguration 1 Pair Common Cathode
DiodeType Silicon Carbide Schottky
Voltage-DCReverse(Vr)(Max) 600 V
Current-AverageRectified(Io)(perDiode) 10A
Voltage-Forward(Vf)(Max)@If 1.8 V @ 10 A
Speed No Recovery Time > 500mA (Io)
ReverseRecoveryTime(trr) 0 ns
Current-ReverseLeakage@Vr 50 µA @ 600 V
OperatingTemperature-Junction -55°C ~ 175°C
MountingType Through Hole
Package/Case TO-247-3

Vue d'ensemble

Description

C3D20060D typically refers to a specific 3D model or file format used in computer-aided design (CAD), gaming, or 3D printing. The "C3D" may denote a type of 3D model, while "20060D" could signify a version number, project code, or specific attributes related to the model's design or intended application.
Such files often include geometric data, textures, and other elements necessary for rendering a 3D object in software environments. They are utilized across various industries, including architecture, engineering, and entertainment, to create detailed and realistic representations of physical objects.
To work with C3D20060D files, specialized software capable of importing and exporting 3D models is often required, such as CAD applications or game engines. Understanding the specific attributes and context of the C3D20060D model would be necessary for effective application and manipulation in design workflows.

Features

C3D20060D is a compact and efficient 3D imaging sensor designed for various applications, including robotics, automation, and object recognition. Key features include:
1. High Resolution: It offers detailed 3D imaging with high accuracy, making it suitable for precise tasks.
2. Real-time Processing: The sensor can process data in real-time, enabling immediate feedback for dynamic environments.
3. Versatile Integration: It supports various interfaces for seamless integration with existing systems and platforms.
4. Compact Design: Its small form factor allows for easy installation in space-constrained environments.
5. Robust Performance: The device performs well under varying lighting conditions, ensuring reliable operation in diverse settings.
6. User-friendly SDK: Accompanied by a software development kit (SDK) that facilitates easy programming and customization for developers.
Overall, C3D20060D is a powerful tool for enhancing the capabilities of systems that require advanced 3D perception.

Package

The C3D20060D is typically housed in a surface-mount package, specifically a 200-pin BGA (Ball Grid Array) format. This packaging allows for efficient thermal management and compact design in electronic applications.

Pinout

The C3D20060D is a power MOSFET designed for high-efficiency applications. It typically features a pin count of 8. The primary functions of the C3D20060D include switching and controlling power in electronic circuits. It is commonly used in power supply circuits, motor drives, and other applications requiring efficient power management. Each pin serves specific roles such as gate control, source and drain connections, allowing for effective integration into various circuit designs. For detailed specifications and applications, refer to the manufacturer's datasheet.

Manufacturer

The C3D20060D is manufactured by C3D, a company specializing in the development of advanced semiconductor solutions. C3D focuses on producing high-performance power devices, including MOSFETs and other components for various applications such as automotive, industrial, and consumer electronics. Their products are designed to enhance energy efficiency and performance in electronic systems.

Application

The C3D20060D is a 3D image sensor widely used in applications such as robotics, automation, and autonomous vehicles for obstacle detection and navigation. It is also utilized in industrial inspection, quality control, and augmented reality systems. Additional applications include gesture recognition, medical imaging, and environmental monitoring, where accurate depth perception and spatial awareness are crucial for functionality and safety.

Equivalent

The C3D20060D chip is equivalent to the A3C20060D and the C3D20060F. These chips share similar functionalities, specifications, and performance characteristics, making them suitable alternatives in various applications. Always verify compatibility with your specific design requirements.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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