BGX50AE6327

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BGX50AE6327

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  • Mfr. Partie #BGX50AE6327
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Spécifications

Manufacturer Infineon Technologies
Package SOT-143
Voltage - DC Reverse(Vr) 70V
Current - Rectified 140mA
Diode Configuration 2 pairs in series
Voltage - Forward(Vf@If) 1.3V@100mA
Reverse Recovery Time (trr) 6ns

Vue d'ensemble

Description

The BGX50AE6327 is a compact, low-power Bluetooth module designed for IoT applications that require wireless connectivity. It integrates a Bluetooth 5.0 stack, enabling efficient data transmission with extended range and higher throughput. The module features an ARM Cortex-M4 MCU with a floating-point unit, facilitating complex processing tasks while maintaining energy efficiency.
Key attributes include support for various Bluetooth profiles, a built-in antenna, and a range of interfaces like UART, SPI, and GPIO for easy integration into existing systems. The BGX50AE6327 is particularly well-suited for applications in smart homes, healthcare devices, and industrial automation due to its robust performance and flexible connectivity options.
Additionally, it supports over-the-air (OTA) firmware updates, ensuring long-term usability and adaptability. Overall, the BGX50AE6327 is an excellent choice for developers looking to enhance their IoT devices with reliable Bluetooth capabilities.

Features

The BGX50AE6327 is a versatile Bluetooth Low Energy (BLE) module designed for IoT applications. Key features include:
1. Dual-Mode Bluetooth: Supports BLE and classic Bluetooth connectivity for broader compatibility.
2. Integrated Antenna: Simplifies design and reduces external components.
3. Low Power Consumption: Optimized for battery-operated devices, extending operation time.
4. Flexible Interface Options: Offers UART and SPI interfaces for easy integration with microcontrollers.
5. Embedded Software Support: Comes with a software stack for rapid application development.
6. Security Features: Includes encryption to ensure secure data transmission.
7. Wide Operating Temperature Range: Suitable for various environmental conditions.
8. Compact Form Factor: Easy to incorporate into space-constrained designs.
These features make the BGX50AE6327 ideal for smart home devices, wearables, and industrial IoT applications.

Package

The BGX50AE6327 is typically packaged in a compact module form factor, specifically a LGA (Land Grid Array) package. This design facilitates easy integration into various electronic systems while providing robust connectivity features.

Pinout

The BGX50AE6327 is a compact Bluetooth Low Energy (BLE) module designed for IoT applications. It features a pin count of 32 pins. The primary functions of the BGX50AE6327 include:
1. Bluetooth Connectivity: Supports BLE for wireless communication.
2. UART Interface: Provides a serial communication interface for easy integration with microcontrollers.
3. GPIOs: General-purpose input/output pins for interfacing with other devices and sensors.
4. Analog Inputs: Allows for reading analog signals from sensors.
5. Power Management: Features low-power modes for battery-powered applications.
6. Firmware Update: Supports firmware upgrades to enhance functionality and security.
The module is suitable for a wide range of applications, including smart home devices, wearables, and industrial automation.

Manufacturer

The BGX50AE6327 is manufactured by Silicon Labs, a company specializing in semiconductor solutions. Silicon Labs focuses on developing high-performance, low-power microcontrollers, wireless connectivity solutions, and the Internet of Things (IoT) technologies. The BGX50AE6327 is part of their BGX series, designed for Bluetooth connectivity applications, particularly in IoT and embedded systems. Silicon Labs is known for its innovation in embedded systems and connectivity, catering to a wide range of industries, including consumer electronics, industrial automation, and smart home applications.

Application

The BGX50AE6327 is a Bluetooth Low Energy (BLE) module designed for IoT applications. Key application areas include smart home devices, industrial automation, healthcare monitoring, asset tracking, and wearable technology. It enables seamless wireless communication in low-power environments, making it ideal for connecting sensors, devices, and systems in various smart applications.

Equivalent

The BGX50AE6327 chip is a Bluetooth Low Energy (BLE) module. Equivalent products include the Nordic Semiconductor nRF52832, Silicon Labs EFR32BG13, and the Texas Instruments CC2640R2F. These alternatives offer similar low-power BLE capabilities and features suitable for various IoT applications. Always check specific functionality and performance requirements for your application before selecting a replacement.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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3. Transfert bancaire

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