BGM123A256V2R

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BGM123A256V2R

RF TXRX MOD BLUETOOTH CHIP SMD

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Spécifications

Part Status Active
RF Family/Standard Bluetooth
Protocol Bluetooth v4.2
Modulation GFSK
Frequency 2.4GHz
Data Rate 1Mbps
Power - Output 8dBm
Sensitivity -90dBm
Serial Interfaces I2C, I2S, SPI, UART
Antenna Type Integrated, Chip
Memory Size 256kB Flash, 32kB RAM
Voltage - Supply 1.85V ~ 3.8V
Current - Receiving 9mA
Current - Transmitting 8.2mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package / Case 56-SMD Module
Base Product Number BGM123
DigiKey Programmable Not Verified

Vue d'ensemble

Description

BGM123A256V2R is a Bluetooth Low Energy (BLE) module designed for IoT applications, offering compact size and low power consumption. It features a built-in antenna and supports various connectivity options, making it suitable for smart home devices, wearables, and industrial applications. The module is based on a powerful microcontroller with ample flash memory (256 KB) and RAM, allowing for complex application development.
Key features include:
- Bluetooth 5.0 support for enhanced range and data throughput.
- Low power operation, ideal for battery-powered applications.
- Integrated security features, including AES encryption.
- Flexible I/O options, facilitating integration with various sensors and actuators.
The BGM123A256V2R is compatible with the Silicon Labs development environment, providing libraries and tools for rapid application development. Overall, it enables developers to create efficient and reliable wireless solutions with minimal complexity.

Features

The BGM123A256V2R is a Bluetooth Low Energy (BLE) module designed for IoT applications. Key features include:
1. Compact Design: Small form factor suitable for space-constrained applications.
2. Integrated Antenna: Built-in antenna for easy deployment without additional components.
3. Low Power Consumption: Optimized for battery-operated devices, ensuring long operational life.
4. High Performance: Supports Bluetooth 5.0 with enhanced data rates and extended range.
5. Flexible Software: Compatible with various development environments, facilitating easy integration and customization.
6. Security Features: Supports advanced security protocols to ensure data integrity and privacy.
7. Versatile Interface: Offers multiple I/O options, including GPIO, UART, SPI, and I2C for diverse connectivity.
8. Rich Development Ecosystem: Backed by a comprehensive SDK and development tools for rapid prototyping.
These features make the BGM123A256V2R suitable for applications in smart home devices, wearables, and industrial automation.

Package

The BGM123A256V2R is packaged in a QFN (Quad Flat No-lead) format, specifically a 32-pin QFN package. This compact package type is designed for efficient thermal performance and minimized footprint, making it suitable for various applications in wireless and sensor devices.

Pinout

The BGM123A256V2R is a Bluetooth System-on-Chip (SoC) from Silicon Labs. It features a 32-pin package. This chip is designed for low-power wireless applications and includes multiple functionalities such as:
- Bluetooth Low Energy (BLE) support for wireless connectivity.
- Microcontroller (MCU) capabilities with a 32-bit ARM Cortex-M33 core.
- Digital interfaces including UART, SPI, I2C, and GPIOs for peripheral connection.
- Analog functionalities like ADC and DAC for sensor interfacing.
- Power management features for energy-efficient operation.
The pinout includes power supply pins, ground, reset, and programming/debugging interfaces, as well as I/O pins that can be configured for various applications. This versatility makes it suitable for IoT devices, wearables, and smart home applications.

Manufacturer

The BGM123A256V2R is manufactured by Silicon Labs, a company that specializes in developing semiconductor solutions and software for various applications, including the Internet of Things (IoT), automotive, industrial, and consumer electronics. Silicon Labs is known for its focus on connectivity, energy efficiency, and innovative technology, providing products such as microcontrollers, wireless chips, and sensors. Their solutions enable customers to create smart, connected devices and systems, emphasizing low power consumption and high performance.

Application

BGM123A256V2R is a Bluetooth Low Energy (BLE) module ideal for applications in smart home devices, wearables, health monitoring, industrial automation, and IoT solutions. Its compact size and energy efficiency make it suitable for battery-operated devices, enabling wireless communication and data exchange in various environments.

Equivalent

The BGM123A256V2R chip is a Bluetooth Low Energy (BLE) SoC. Equivalent products include the Nordic Semiconductor nRF52832, nRF52840, and the Silicon Labs EFR32MG1, EFR32MG12 series. For specific applications, you may also consider Microchip's RN4871 or STMicroelectronics' BlueNRG series. Always check the specific features and specifications to ensure compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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