BGM113A256V2R

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BGM113A256V2R

RX TXRX MOD BLUETOOTH CHIP SMD

  • Fabricant
  • Mfr. Partie #BGM113A256V2R
  • Paquet 36-SMDModule
  • Fiche de données
  • En stock2508

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Spécifications

Package Tape & Reel (TR),Cut Tape (CT)
Series Blue Gecko
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v4.1
Frequency 2.4GHz
DataRate 1Mbps
Power-Output 3dBm
Sensitivity -93dBm
SerialInterfaces SPI, UART
AntennaType Integrated, Chip
UtilizedIC/Part EFR32BG
MemorySize 256kB Flash, 32kB RAM
Voltage-Supply 3.8V
Current-Receiving 8.7mA
Current-Transmitting 8.8mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

Vue d'ensemble

Description

The BGM113A256V2R is a Bluetooth module designed by Silicon Labs. It is part of the Blue Gecko family, renowned for its low energy consumption and robust connectivity solutions in IoT applications. This module integrates a Bluetooth 4.2 stack and is designed for applications that require Bluetooth Low Energy (BLE). It features a powerful ARM Cortex-M4 processor with 256 kB of flash memory and 32 kB of RAM, offering high performance and efficiency.
The BGM113A256V2R provides several GPIOs and peripheral interfaces, making it versatile for integrating into various devices. Its small form factor is ideal for space-constrained applications, and it supports extensive development tools and resources from Silicon Labs, including the Simplicity Studio IDE. Developers appreciate its ease of use, rapid prototyping capabilities, and the convenience of the pre-certified module, which simplifies regulatory compliance processes.
Overall, the BGM113A256V2R is an excellent choice for developers looking to implement BLE functionality in their products with minimal power use, owing to its energy-efficient design and comprehensive support ecosystem.

Features

The BGM113A256V2R is a compact, Bluetooth Smart (Bluetooth Low Energy) module designed for wireless connectivity applications. Key features include:
1. Bluetooth 4.2 Compliance: Supports Bluetooth Low Energy 4.2 for efficient, low-power wireless communication.
2. Integrated Antenna: Comes with a built-in chip antenna, simplifying design and reducing the need for additional components.
3. Size: Compact form factor, facilitating easy integration into various devices.
4. Processor: Equipped with an ARM Cortex-M4 processor with 32-bit architecture for efficient processing capabilities.
5. Memory: Contains 256 kB of Flash memory and 32 kB of RAM for application storage and execution.
6. Low Power Consumption: Designed for applications requiring energy efficiency, ideal for battery-powered devices.
7. Peripheral Support: Includes various interfaces such as UART, SPI, I2C, and GPIO for flexibility in connecting with other components.
8. Operating Temperature: Suitable for a range of environments with an operating temperature of -40°C to +85°C.
9. Regulatory Compliance: Pre-certified for worldwide operation, reducing the need for additional compliance testing.
This module is suitable for applications in IoT devices, wearable technology, and other wireless communication systems.

Package

The BGM113A256V2R is a compact Bluetooth module from Silicon Labs featuring an integrated antenna. It is designed in a surface-mount package, specifically in a QFN (Quad Flat No-leads) package type for easy integration into wireless applications.

Pinout

The BGM113A256V2R is a Bluetooth Smart module from Silicon Labs. It features a 32-pin QFN package. This module is designed for Bluetooth Low Energy (BLE) applications and integrates a 32-bit ARM Cortex-M4 processor with 256 kB Flash and 32 kB RAM. The BGM113A256V2R is primarily used for wirelessly connecting devices and can support various applications such as health and fitness devices, smart home applications, and wearables.
Key functions include:
1. Bluetooth Low Energy Connectivity: Enables wireless communication adhering to Bluetooth 4.2 standards.
2. Integrated MCU: The ARM Cortex-M4 processor allows for efficient processing and control.
3. Peripheral Interfaces: Includes UART, SPI, I2C, PWM, and ADC interfaces for flexibility in connecting with other devices and sensors.
4. Low Power Consumption: Designed for battery-operated devices with energy-efficient operation.
5. Compact Design: The 32-pin QFN package offers a compact form factor, ideal for space-constrained applications.
This module provides a complete solution for BLE applications by combining processing power with connectivity features.

Manufacturer

The BGM113A256V2R is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in the design and development of semiconductors, software, and systems solutions. The company is known for its expertise in wireless technologies, microcontrollers, sensors, and other electronic components that enable the Internet of Things (IoT) and other connected applications. Silicon Labs provides products and solutions for a wide range of industries, including smart home, industrial automation, consumer electronics, and more.

Application

The BGM113A256V2R is a Bluetooth Low Energy (BLE) module used in various applications such as wearable technology, health and fitness devices, smart home automation, and Internet of Things (IoT) devices. Its compact size and low power consumption make it ideal for battery-operated products, while its reliable connectivity supports applications requiring wireless data transfer and remote control. Additionally, it is employed in consumer electronics, asset tracking, and industrial automation systems.

Equivalent

The BGM113A256V2R is a Bluetooth module from Silicon Labs. Equivalent products might include:
1. Nordic Semiconductor nRF52832 - A versatile SoC with Bluetooth 5 capabilities.
2. Dialog Semiconductor DA14531 - An energy-efficient Bluetooth 5.1 SoC.
3. Texas Instruments CC2640R2F - A SimpleLink Bluetooth Low Energy wireless MCU.
4. Microchip RN4871 - A Bluetooth 4.2 module.
These alternatives offer similar functionalities in terms of Bluetooth connectivity but may vary in specific features and performance. Always compare datasheets for precise matching.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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