BCM82756AKFSBG

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BCM82756AKFSBG

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  • Fabricant
  • Mfr. Partie #BCM82756AKFSBG
  • Paquet BGA-256
  • Fiche de données
  • En stock6623

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Spécifications

Package Tray
ProductStatus Active
Function Switch
Interface XFI, 2-Wire Serial
NumberofCircuits 4
Voltage-Supply 1V
OperatingTemperature 0°C ~ 70°C
MountingType Surface Mount
Package/Case 256-BGA

Vue d'ensemble

Description

The BCM82756AKFSBG is a high-performance digital signal processor (DSP) developed by Broadcom, primarily used in networking applications. It is designed for advanced optical transport networks (OTN) and supports enhanced features for managing high-bandwidth data transmission in telecommunications. This device integrates various functionalities, including forward error correction (FEC), packet processing, and the ability to handle multiple data formats, making it suitable for both wired and wireless communications.
The BCM82756AKFSBG is notable for its scalability and ability to support high-speed interfaces, allowing it to manage large volumes of data with low latency. It is often employed in routers, switches, and other networking equipment to improve efficiency and reliability. Overall, this DSP is a crucial component in modern networking infrastructures, enhancing data integrity and processing capabilities.

Features

The BCM82756AKFSBG is a high-performance integrated circuit designed by Broadcom, primarily for broadband access applications. Key features include:
1. Integrated Functionality: Combines multiple functions such as a digital signal processor (DSP), analog front-end (AFE), and various interfaces to streamline design and reduce component count.

2. Support for Multiple Standards: Compatible with various broadband technologies, particularly DOCSIS (Data Over Cable Service Interface Specification) and other cable modem standards.
3. High Data Rates: Capable of supporting high-speed data transmission, enhancing internet service capabilities.
4. Low Power Consumption: Designed for energy efficiency, making it suitable for residential and commercial applications.
5. Flexible Interfaces: Supports various interfaces for connectivity, including Ethernet and USB, allowing for versatile application in networking hardware.
6. Robust Performance: Optimized for reliable operation in diverse environments, ensuring stable broadband service.
This chip is ideal for manufacturers looking to develop next-generation modem and gateway solutions.

Package

The BCM82756AKFSBG is packaged in a 144-pin LQFP (Low-Profile Quad Flat Package) configuration. This type of package provides a low profile and facilitates effective heat dissipation, making it suitable for various electronic applications.

Pinout

The BCM82756AKFSBG is a high-performance, multi-channel transceiver designed for optical communications. It features a pin count of 64 pins in a FCLGA (Fine-Pitch Ball Grid Array) package.
The primary functions of the BCM82756 include:
1. Multiplexing and Demultiplexing: It supports the aggregation and disaggregation of multiple data channels, facilitating high-speed data transfer.
2. Signal Conditioning: The device provides signal processing capabilities to enhance the integrity of data transmission.
3. SerDes Interface: It features Serializer/Deserializer functionality for converting parallel data into serial form and vice versa.
4. Network Interfaces: The BCM82756 supports various networking standards, making it suitable for applications in data center interconnects and metro networks.
This component is typically used in high-capacity networking applications, including Ethernet and optical interface solutions.

Manufacturer

The BCM82756AKFSBG is manufactured by Broadcom Inc., a global technology company that specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Founded in 1991 and headquartered in San Jose, California, Broadcom serves various markets, including data center, networking, broadband, wireless, and automotive. The company is known for its innovations in connectivity and networking technologies, producing chips that enable high-speed data transfer and communication across different devices and systems. Broadcom operates as a key player in the semiconductor industry, providing products that are integral to modern electronics and telecommunications.

Application

The BCM82756AKFSBG is primarily used in telecommunications and networking applications. It serves in broadband access systems, particularly for fiber-to-the-home (FTTH) deployments, enabling high-speed data transmission. Its functionalities include support for PON (Passive Optical Networks) technologies, facilitating efficient data routing and management in optical networks, as well as powering various DSL and cable modem solutions.

Equivalent

The BCM82756AKFSBG is a Broadcom chip primarily used for video processing and transmission applications. Equivalent products can include the Texas Instruments TMS320DM6437, the NXP SAA7113, and the Analog Devices ADV7842. However, compatibility may vary based on specific application requirements, so it's essential to check datasheets and specifications for detailed equivalency.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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