BCM7335TKFEBB3G

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BCM7335TKFEBB3G

Broadcom Limited

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Spécifications

Vue d'ensemble

Description

The BCM7335TKFEBB3G is a system-on-chip (SoC) designed by Broadcom, primarily used in broadband and multimedia applications. This chip integrates various functionalities, including video decoding, advanced graphics processing, and high-speed networking capabilities, making it suitable for set-top boxes, smart TVs, and other home entertainment devices.
Key features often include support for high-definition (HD) and 4K video playback, robust audio processing, and enhanced connectivity options such as Wi-Fi and Ethernet. The BCM7335 is built to support multiple streaming services and advanced user interfaces, ensuring a seamless viewing experience. Its architecture allows for efficient power consumption, which is essential for devices that operate continuously.
Overall, the BCM7335TKFEBB3G is a versatile solution for manufacturers looking to deliver high-performance multimedia products in an increasingly competitive market.

Features

The BCM7335TKFEBB3G is a system-on-chip (SoC) designed by Broadcom for set-top boxes and broadband applications. Key features include:
1. High Performance: It supports advanced processing capabilities for handling 4K Ultra HD video and high-efficiency codecs.
2. Integrated Graphics: Features a powerful GPU for enhanced graphical performance and user interface responsiveness.
3. Multimedia Support: Compatibility with various video formats, including HEVC, VP9, and AV1, enabling efficient streaming and playback.
4. Connectivity: Includes integrated Wi-Fi and Ethernet options for robust internet connectivity and streaming capabilities.
5. Security: Implements hardware-level security features to protect content and user data.
6. Power Efficiency: Designed for low power consumption, making it suitable for energy-efficient consumer electronics.
7. Flexible Interfaces: Supports multiple interfaces for connectivity, including HDMI, USB, and SATA, offering versatility in device integration.
Overall, the BCM7335TKFEBB3G is tailored for next-generation entertainment systems, optimizing both performance and energy efficiency.

Package

The BCM7335TKFEBB3G is packaged in a 24mm x 24mm FCLGA (Fine Pitch Ball Grid Array) format. This type of package is designed for high-density applications, offering efficient thermal management and electrical performance suitable for broadband and multimedia applications.

Pinout

The BCM7335TKFEBB3G is a system-on-chip (SoC) designed by Broadcom, typically used in set-top boxes and similar devices. It features a pin count of 192 pins. The primary functions of the BCM7335 include high-definition video decoding, advanced graphics processing, and support for various multimedia applications. It integrates multiple components, such as a CPU, GPU, and video decoder, which enable it to handle streaming, gaming, and other digital content effectively. The chip supports various interfaces, including HDMI, Ethernet, and USB, to facilitate connectivity and data transfer.

Manufacturer

The BCM7335TKFEBB3G is manufactured by Broadcom Inc., a global technology company known for designing and developing a wide range of semiconductor and infrastructure software solutions. Broadcom specializes in networking, broadband, enterprise storage, and wireless communication technologies. The company serves various markets, including data centers, telecommunications, and consumer electronics, providing innovative solutions that enable connectivity and enhance performance in multiple applications. Broadcom is recognized for its extensive portfolio, which includes integrated circuits and software for both wired and wireless communication.

Application

The BCM7335TKFEBB3G is a System-on-Chip (SoC) designed for high-definition (HD) and ultra-high-definition (UHD) set-top boxes, smart TVs, and multimedia streaming devices. It supports advanced video decoding, high-performance processing, and multiple connectivity options, making it suitable for applications in cable, satellite, and IPTV services. Additionally, it enables features like 4K video playback, digital rights management (DRM), and interactive user interfaces.

Equivalent

The BCM7335TKFEBB3G chip is a Broadcom SoC primarily used in set-top boxes and digital TV applications. Equivalent products include the Broadcom BCM7356 and BCM7358, which also offer similar functionalities for video processing and streaming. For alternatives from other manufacturers, consider the DVB-S2 and DVB-C SoCs from companies like Intel (e.g., Intel CE Media processors) or MediaTek (e.g., MTK 8650 series). Always verify compatibility based on specific application requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire