BCM68622B0IFSBG

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BCM68622B0IFSBG

16XGPON/16XEPON OLT, I-TEMP

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  • Mfr. Partie #BCM68622B0IFSBG
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  • En stock2436

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Spécifications

Package Tray
ProductStatus Active
Function EPON OLT
OperatingTemperature -40°C ~ 85°C

Vue d'ensemble

Description

The BCM68622B0IFSBG is a System-on-Chip (SoC) developed by Broadcom, primarily designed for Internet of Things (IoT) applications and connected devices. It integrates a powerful processor with various connectivity options, including Wi-Fi and Bluetooth, enabling seamless communication and data transfer. The SoC is optimized for low power consumption, making it suitable for battery-operated devices.
Key features include support for advanced security protocols, high-performance processing capabilities, and a range of peripheral interfaces. This makes the BCM68622B0IFSBG ideal for smart home devices, wearables, and industrial IoT applications. Its compact design facilitates easy integration into various products, enhancing functionality while minimizing space requirements.
Overall, the BCM68622B0IFSBG is a versatile chip that facilitates the development of innovative, connected products within the expanding IoT ecosystem.

Features

The BCM68622B0IFSBG is a highly integrated System on Chip (SoC) designed for wireless communication, particularly in Bluetooth and Wi-Fi applications. Key features include:
1. Dual-Mode Bluetooth: Supports Classic Bluetooth and Bluetooth Low Energy (BLE), enabling versatile wireless connectivity.
2. Wi-Fi Capabilities: Integrates advanced Wi-Fi features, supporting both 2.4 GHz and 5 GHz bands for improved performance.
3. High Throughput: Designed for high data rates, making it suitable for applications requiring fast data transfer.
4. Low Power Consumption: Optimized for energy efficiency, making it ideal for battery-powered devices.
5. Integrated RF Front-End: Reduces the need for external components, simplifying design and reducing costs.
6. Security Features: Includes robust security protocols to ensure secure communications.
7. Flexible Interface Options: Supports multiple communication interfaces, such as SPI, I2C, and UART, enhancing integration with various systems.
This SoC is well-suited for IoT devices, wearables, and smart home applications.

Package

The BCM68622B0IFSBG is packaged in a 48-pin LQFP (Low-profile Quad Flat Package).

Pinout

The BCM68622B0IFSBG is a System-on-Chip (SoC) from Broadcom designed for broadband applications. It features a pin count of 100 pins in a QFN package. The primary functions of the BCM68622 include:
1. Broadband Processing: It supports various broadband technologies, including DSL and cable, enabling high-speed internet connectivity.
2. Integrated CPU: The SoC includes a powerful CPU for managing data processing tasks.
3. Networking: It provides Ethernet interfaces for local networking and connectivity.
4. Memory Interfaces: The device supports external memory interfaces for increased storage and performance.
5. Peripheral Interfaces: It includes multiple peripheral interfaces such as USB, SPI, I2C, and GPIO for connecting additional devices.
Overall, the BCM68622B0IFSBG is designed for efficient broadband applications with integrated processing and connectivity features.

Manufacturer

The BCM68622B0IFSBG is manufactured by Broadcom Inc., a global technology company headquartered in San Jose, California. Broadcom specializes in designing, developing, and supplying a broad range of semiconductor and infrastructure software solutions. The company serves various sectors, including data center, networking, software, broadband, wireless, and storage, providing advanced technologies that facilitate high-speed communication and connectivity. Broadcom is known for its innovative products and plays a significant role in the semiconductor industry, contributing to the development of various electronic devices and systems.

Application

The BCM68622B0IFSBG is a dual-band, wireless communication chip commonly used in applications such as broadband routers, gateways, and access points. It supports high-speed Wi-Fi connectivity and is suitable for smart home devices, IoT applications, and enterprise networking solutions, enabling seamless internet access and efficient data transmission in various environments.

Equivalent

The BCM68622B0IFSBG chip, a Broadcom Wi-Fi and Bluetooth combo solution, has several equivalent products such as the Qualcomm QCA9880, Intel 7265, and the MediaTek MT7615. These alternatives also provide integrated Wi-Fi and Bluetooth connectivity, suitable for similar applications in wireless communications. Always verify compatibility with specific requirements before selecting an equivalent.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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