BCM68570IFBG

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BCM68570IFBG

GPON VOIP PROCESSOR

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  • Mfr. Partie #BCM68570IFBG
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Spécifications

Part Status Obsolete
DigiKey Programmable Not Verified

Vue d'ensemble

Description

The BCM68570IFBG is a system-on-chip (SoC) developed by Broadcom, primarily designed for high-performance networking applications. This chip is part of the BCM6857x series and is often used in broadband gateways, routers, and other networking devices. It features a multi-core ARM architecture, providing efficient processing capabilities for handling multiple tasks simultaneously, which is crucial for managing high-speed Internet connections and multiple user demands.
Key specifications typically include integrated support for Wi-Fi technologies (such as 802.11ac), advanced security features, and high throughput capabilities. The BCM68570IFBG supports various interfaces, enabling connectivity with Ethernet ports, USB, and other peripherals. Its design focuses on power efficiency, making it suitable for residential and small business environments where reliable and fast Internet connectivity is essential. Overall, the BCM68570IFBG is a versatile and robust solution for modern networking needs.

Features

The BCM68570IFBG is a versatile system-on-chip (SoC) designed primarily for broadband applications, such as gateways and routers. Key features include:
1. High Performance: It typically includes a multi-core ARM CPU, offering efficient processing for data-intensive tasks.
2. Integrated Networking: Features advanced networking capabilities with integrated Ethernet and Wi-Fi support, including dual-band Wi-Fi (2.4 GHz and 5 GHz).
3. Security: Incorporates security features to support VPNs and firewall functionalities, enhancing data protection.
4. Support for Multiple Interfaces: Includes USB, SATA, and PCIe interfaces, offering flexibility for peripheral connectivity.
5. Multi-Gigabit Ethernet: Supports high-speed Ethernet connections, suitable for high-bandwidth applications.
6. Energy Efficiency: Designed for low power consumption, contributing to energy savings in devices.
Overall, the BCM68570IFBG is ideal for advanced networking solutions, catering to both consumer and enterprise markets.

Package

The BCM68570IFBG is packaged in a BGA (Ball Grid Array) format, specifically in a 14mm x 14mm package. This type of packaging provides efficient thermal performance and is suitable for high-density applications.

Pinout

The BCM68570IFBG is a system-on-chip (SoC) designed by Broadcom, primarily for broadband applications such as DSL and cable modems. It features a pin count of 256 pins. The device integrates various functionalities, including a CPU, networking interfaces, and support for multiple broadband technologies.
Key functions of the BCM68570 include:
1. High-Performance CPU: It typically includes a multi-core processor for efficient data handling.
2. Integrated Modem: Supports multiple standards for broadband connectivity (e.g., DSL, DOCSIS).
3. Networking Interfaces: Includes Ethernet ports and support for Wi-Fi connectivity, enabling home networking.
4. Memory Interfaces: Provides connections for external memory, facilitating data storage and processing.
5. Support for VoIP: Capable of handling voice over IP applications.
This SoC is used in various networking devices, enhancing performance and connectivity in home and business environments.

Manufacturer

The BCM68570IFBG is manufactured by Broadcom Inc., a global technology company based in the United States. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions, primarily for the networking, broadband, enterprise storage, and wireless communication sectors. The company is known for its innovative products that enable advanced connectivity and data transfer across various devices and technologies. Broadcom serves numerous industries, including telecommunications, data centers, and consumer electronics, and is recognized as a key player in the semiconductor market.

Application

The BCM68570IFBG is a broadband router SoC (System on Chip) designed for high-performance networking applications. It is primarily used in residential gateways, DSL and cable modems, and enterprise routers. Its features support advanced Wi-Fi technologies, multi-gigabit Ethernet, and IoT connectivity, making it suitable for home networking, small to medium businesses, and smart home applications.

Equivalent

The BCM68570IFBG chip, a broadband communications processor, is equivalent to the Broadcom BCM63168 and similar models like the BCM63138. Other possible equivalents may include chips from the same Broadcom family that offer comparable features and specifications for broadband applications. Always verify compatibility based on specific requirements and functionalities.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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