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BCM68461A1KRFBG
EPON/GPON HGU
- Fabricant
- Mfr. Partie #BCM68461A1KRFBG
- Paquet
- Fiche de données
- En stock4110
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Spécifications
| Part Status | Active |
Vue d'ensemble
Description
The chip is ideal for service providers looking to enhance their offerings with robust and efficient home networking solutions. Its architecture allows for seamless handling of multiple devices and high data throughput, ensuring a reliable internet experience. Additionally, the BCM68461A1KRFBG supports various interfaces and protocols, making it versatile for different applications within the broadband ecosystem. Overall, it is engineered to meet the increasing demands of smart homes and IoT environments.
Features
1. Dual-core ARM Cortex-A9 Processor: Offers high performance for rich multimedia and multitasking capabilities.
2. Integrated DOCSIS 3.0 Modem: Supports up to 8x4 channel bonding for enhanced data throughput.
3. Advanced Security Features: Built-in hardware security for secure data transmission.
4. Multiple Connectivity Options: Includes support for Ethernet, USB, and Wi-Fi for versatile connectivity.
5. Integrated Video Processing: Supports high-definition video streaming and telephony services.
6. Power Management Features: Designed for energy efficiency to reduce power consumption.
7. Flexible Software Architecture: Compatible with various operating systems and applications.
This chipset is ideal for service providers looking to deliver high-speed internet and multimedia services in residential and commercial environments.
Package
Pinout
Key functions of the BCM68461 include:
1. Data Processing: It supports advanced packet processing for various networking protocols.
2. Integrated Interfaces: The chip typically includes interfaces such as Ethernet, PCIe, USB, and others, allowing for versatile connectivity.
3. Multicore Architecture: It often features multiple processing cores to enhance performance and efficiency in handling concurrent tasks.
4. Memory Controller: The device usually integrates a memory controller for external DRAM, contributing to high-speed data access and processing capabilities.
For specific pin assignments and detailed functionality, refer to the official datasheet or technical reference manual provided by Broadcom.
Manufacturer
Broadcom is known for its innovations in various technologies, particularly in the fields of broadband access, enterprise networking, and wireless connectivity. The BCM68461 is a system-on-a-chip (SoC) commonly used in networking equipment such as broadband routers and gateways, emphasizing Broadcom's role in the telecommunications and networking industries.
Application
Equivalent
1. Qualcomm QCA9860
2. Marvell Avastar 88W8897
3. Intel Wireless-AC 7260
Always verify specific features and compatibility for your application, as equivalents may vary in performance and specifications.
Expédition
Méthodes d'expéditionNous
offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.
Référence des frais d'expédition (DHL/FedEx):
DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.
FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.
EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.
Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.
Paiements
Payment Methods
Le terme de paiement est 100% prépayé.
Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:
1. PayPal
2. Carte de crédit/débit
3. Transfert bancaire
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