BCM6803IFSBG

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BCM6803IFSBG

RF System on a Chip - SoC

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Spécifications

Standard Pack Qty 833

Vue d'ensemble

Description

BCM6803IFSBG is a low-power, highly integrated Bluetooth and Wi-Fi combo chip designed by Broadcom. It is primarily used in a variety of applications, including consumer electronics, smart home devices, and IoT (Internet of Things) products. The chip supports Bluetooth Classic and Bluetooth Low Energy (BLE), enabling versatile wireless connectivity options.
Key features of the BCM6803IFSBG include advanced power management capabilities, enhanced data rates, and robust security protocols to ensure safe wireless communication. Its compact design allows for integration into space-constrained devices while maintaining high performance.
The chip is compatible with various operating systems and development platforms, making it suitable for developers looking to create connected solutions. With its efficient performance and reliability, the BCM6803IFSBG serves as an essential component for modern wireless applications, contributing to the growth of smart technology ecosystems.

Features

The BCM6803IFSBG is a Bluetooth Low Energy (BLE) SoC (System on Chip) developed by Broadcom. Key features include:
1. Integrated Bluetooth 5.0: Supports long-range communication and higher data rates.
2. Low Power Consumption: Designed for battery-operated devices, optimizing energy efficiency.
3. ARM Cortex-M0: A 32-bit processor core that balances performance with power efficiency.
4. Memory: Includes flash and RAM for storing firmware and application code.
5. Flexible Interface Options: Supports various interfaces such as I2C, SPI, UART, and GPIO for easy integration with sensors and peripherals.
6. On-chip Oscillator: Reduces external component count and simplifies design.
7. Security Features: Includes hardware support for secure connections and data encryption.
8. Development Support: Compatible with various development tools and SDKs for rapid prototyping and development.
The BCM6803IFSBG is ideal for IoT applications, wearable devices, and smart home products, offering a compact solution for Bluetooth connectivity.

Package

The BCM6803IFSBG is packaged in a QFN (Quad Flat No-lead) package type, specifically a 32-pin QFN with a size of 5mm x 5mm. This package type is designed for compactness and enhanced thermal performance.

Pinout

The BCM6803IFSBG is a CMOS integrated circuit from Broadcom, primarily used in network applications, such as Ethernet switches and routers. It features a pin count of 64 pins in a LQFP (Low-profile Quad Flat Package) configuration.
The primary functions of the BCM6803IFSBG include:
1. Network Processing: It handles data packet processing for efficient network communication.
2. Switching: The device is designed for layer 2 and layer 3 switching functionalities.
3. Network Interface: It supports multiple network interfaces, enabling connection to various types of networks.
4. Power Management: The chip includes features for power efficiency, allowing it to manage power consumption effectively.
For specific applications and detailed pin functionalities, the data sheet should be consulted for accurate information.

Manufacturer

The BCM6803IFSBG is manufactured by Broadcom Inc., a global technology company known for its semiconductor and infrastructure software solutions. Established in 1991, Broadcom specializes in a wide range of products, including networking, broadband, wireless, and storage solutions. The company serves various industries, including telecommunications, data centers, and consumer electronics, providing essential components for connectivity and communication technologies. Broadcom is recognized for its innovation in high-performance computing and integration of various technologies into their products.

Application

The BCM6803IFSBG is a Bluetooth Low Energy (BLE) system-on-chip designed for various applications, including smart home devices, wearables, health and fitness trackers, automotive connectivity, industrial automation, and IoT solutions. Its low power consumption and integrated features make it suitable for devices requiring reliable wireless communication and efficient energy management.

Equivalent

The BCM6803IFSBG chip, a Bluetooth controller, has several equivalent products, including the Broadcom BCM20702, Qualcomm CSR8670, and TI CC2564. These chips offer similar functionalities in Bluetooth connectivity for various applications. However, specific compatibility and performance may vary, so it's important to consult the datasheets for detailed specifications.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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