BCM63158B1KFSBG

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BCM63158B1KFSBG

212, BONDED 106, V/ADSL GW

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Vue d'ensemble

Description

The BCM63158B1KFSBG is a highly integrated system-on-chip (SoC) designed by Broadcom for broadband applications, particularly in residential gateways and networking devices. It features a multi-core architecture that supports high-speed data processing, enabling efficient handling of multiple data streams.
Key features of the BCM63158B1KFSBG include support for advanced Wi-Fi standards, integrated Ethernet switching, and capabilities for both voice and video processing. This SoC is optimized for applications requiring high throughput and low latency, making it suitable for high-definition streaming, gaming, and smart home devices.
Additionally, the chip supports various networking protocols and security features, ensuring robust connectivity and user privacy. With its energy-efficient design, the BCM63158B1KFSBG provides a balance between performance and power consumption, making it an ideal choice for modern broadband infrastructure.

Features

The BCM63158B1KFSBG is a highly integrated SoC (System-on-Chip) developed by Broadcom, primarily designed for high-performance broadband applications, including next-generation DSL and fiber access technologies. Key features include:
1. Multi-Core Architecture: Equipped with multiple ARM Cortex-A53 cores, providing substantial processing power for concurrent tasks.
2. High-Speed Interfaces: Supports multiple Ethernet ports (up to 10Gbps) and interfaces for connecting various networking components.
3. Integrated DSP: Features integrated Digital Signal Processing capabilities for efficient handling of signal modulation and error correction.
4. Advanced Security: Built-in security features, including hardware encryption, to protect data and enhance network security.
5. Power Management: Efficient power management capabilities to optimize energy consumption.
6. Flexible Connectivity: Supports multiple WAN and LAN configurations, making it versatile for different deployment scenarios.
This SoC is ideal for service providers looking to deliver high-speed internet and advanced residential gateway solutions.

Package

The BCM63158B1KFSBG is packaged in a FCLGA (Fine Pitch Ball Grid Array) format. This package type is designed for high-performance applications, providing efficient thermal management and connectivity for the integrated circuit.

Pinout

The BCM63158B1KFSBG is a system-on-chip (SoC) designed primarily for broadband applications, specifically for cable and DSL gateways. It features a pin count of 256 pins in a FCLGA (Fine Pitch Land Grid Array) package.
Key functions of the BCM63158B1KFSBG include:
1. High-Performance CPU: It integrates a multi-core ARM CPU to handle various processing tasks efficiently.
2. Integrated Networking: Supports multiple Ethernet interfaces for LAN/WAN connectivity, including Gigabit capabilities.
3. Wi-Fi Support: May include support for integrated Wi-Fi functionality, allowing for wireless communications.
4. Memory Interfaces: Supports various memory types for storage and operational needs, including DDR3/DDR4 RAM.
5. Advanced Security Features: Provides built-in security mechanisms to ensure safe data transmission.
This SoC is optimized for high-speed data processing, making it suitable for high-performance residential and commercial broadband applications.

Manufacturer

The BCM63158B1KFSBG is manufactured by Broadcom Inc., a global technology company headquartered in San Jose, California. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Their products are used in various applications, including networking, broadband, enterprise storage, and wireless communications. Broadcom is known for its innovative technologies and plays a significant role in enabling connectivity and data transfer across diverse industries, making it a key player in the semiconductor sector.

Application

The BCM63158B1KFSBG is a highly integrated SoC (System on Chip) designed for broadband applications, particularly in DSL and fiber access networks. Its application areas include residential gateways, routers, and residential broadband equipment, enabling high-speed internet access and efficient data processing. The chip supports advanced networking features, including VoIP and IPTV, and is suitable for service providers aiming to deliver enhanced connectivity and multimedia services.

Equivalent

The BCM63158B1KFSBG chip is a broadband network processor primarily used in wireless routers and gateways. Equivalent products include the Broadcom BCM63158, BCM63158B0, and similar models from other manufacturers like Intel's PUMA series and Qualcomm's QSR series. For specific applications, alternatives may also include chips from Marvell and MediaTek. Always verify compatibility with your specific use case.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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