BCM5892PC0KFB266G

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BCM5892PC0KFB266G

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Spécifications

Part Status Obsolete
Base Product Number BCM5892

Vue d'ensemble

Description

The BCM5892PC0KFB266G is a system-on-chip (SoC) developed by Broadcom, primarily designed for mobile and embedded applications. It integrates various functionalities, making it suitable for IoT devices, wearables, and other portable electronics. Key features typically include a powerful ARM-based processor, support for multiple connectivity options such as Bluetooth and Wi-Fi, and enhanced energy efficiency for extended battery life.
The BCM5892 is optimized for low power consumption, making it ideal for applications requiring constant connectivity without draining resources quickly. Additionally, it often supports advanced features like voice processing, sensor fusion, and security protocols, catering to the growing demand for smart, connected devices.
In summary, the BCM5892PC0KFB266G is a versatile SoC that combines processing power and connectivity in a compact, energy-efficient package, suitable for a wide range of modern technology applications.

Features

The BCM5892PC0KFB266G is a highly integrated system-on-chip (SoC) designed primarily for embedded applications requiring Bluetooth and Wi-Fi connectivity. Key features include:
1. Dual-Band Wi-Fi: Supports both 2.4 GHz and 5 GHz bands, enhancing wireless performance and flexibility.
2. Bluetooth 5.0: Ensures high-speed data transfer, improved range, and energy efficiency for connected devices.
3. Low Power Consumption: Designed for battery-operated devices, optimizing energy use while maintaining performance.
4. Multiple Interfaces: Supports various interfaces including SPI, I2C, UART, and GPIO for versatile connectivity with peripherals.
5. Integrated MCU: Features a microcontroller unit for local processing, reducing latency and improving responsiveness.
6. Security Features: Incorporates robust security protocols to safeguard data and ensure secure communication.
7. Compact Form Factor: Ideal for space-constrained applications in IoT, wearables, and smart home devices.
Overall, the BCM5892PC0KFB266G is a versatile solution for developers looking to implement reliable wireless connectivity in their projects.

Package

The BCM5892PC0KFB266G is packaged in a BGA (Ball Grid Array) format. This type of package provides an efficient thermal and electrical performance, suitable for compact applications in mobile and embedded devices.

Pinout

The BCM5892PC0KFB266G is a System-on-Chip (SoC) from Broadcom, specifically designed for wireless applications. It features a pin count of 256 and integrates various functionalities to support advanced connectivity, including Bluetooth and Wi-Fi.
The primary functions of the BCM5892 include processing for wireless communication, power management, and support for a range of peripherals. This SoC is optimized for low power consumption and high performance, making it suitable for portable devices and IoT applications. It supports multiple connectivity protocols and has built-in features for efficient data handling and processing.
For detailed specifications, including exact pin assignments and their dedicated functions, it is advisable to consult the official Broadcom datasheet for the BCM5892.

Manufacturer

The BCM5892PC0KFB266G is manufactured by Broadcom Inc., a global technology company that specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Broadcom is known for its expertise in various sectors, including networking, broadband, enterprise storage, and wireless communications. The company plays a significant role in the semiconductor industry, providing components for applications in data centers, telecommunication, and consumer electronics. Broadcom's products are integral to enabling connectivity and enhancing data processing capabilities across multiple devices and platforms.

Application

The BCM5892PC0KFB266G is a Bluetooth and Wi-Fi combo chip designed for various applications, including IoT devices, wearables, smart home products, industrial automation, and consumer electronics. It supports low-power communication, making it suitable for battery-operated devices requiring efficient connectivity. Additionally, it is used in automotive applications for enhanced connectivity features.

Equivalent

The BCM5892PC0KFB266G is a Broadcom Bluetooth and Wi-Fi combo chip. Equivalent products include the Qualcomm QCA9377, Intel Dual Band Wireless-AC 7265, and Cypress CYW43455. These alternatives also support Bluetooth and Wi-Fi connectivity in similar applications. Ensure compatibility with your specific requirements and designs.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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