BCM56640B0IFSBLG

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BCM56640B0IFSBLG

MULTI LAYER SWITCH

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  • Mfr. Partie #BCM56640B0IFSBLG
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  • En stock22625

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Spécifications

Part Status Obsolete
Protocol Ethernet
Function Switch
Standards IEEE 802.3

Vue d'ensemble

Description

The BCM56640B0IFSBLG is a network switch chip developed by Broadcom, designed for high-performance enterprise and data center applications. It supports advanced Layer 2 and Layer 3 features, making it suitable for various networking tasks, including routing and switching. This chip is part of Broadcom's StrataXGS family, offering a high level of integration with support for Ethernet, multicast, and unicast traffic.
Key features include support for multiple Gigabit Ethernet and 10 Gigabit Ethernet ports, high-density connectivity, and programmable software capabilities, which allow for flexibility in deployment. Its architecture is optimized for power efficiency and performance, catering to the demands of modern network infrastructures.
The BCM56640B0IFSBLG is often used in enterprise switches, service provider equipment, and cloud data centers, enabling efficient data handling and management in scalable environments.

Features

The BCM56640B0IFSBLG is a high-performance Ethernet switch chipset designed by Broadcom, featuring advanced capabilities for networking applications. Key features include:
1. Ports: It supports up to 48 10/100/1000 Mbps Ethernet ports with a flexible configuration for uplinks.
2. Layer 2/Layer 3 Switching: It provides Layer 2 switching with advanced features like VLAN support, and Layer 3 routing capabilities.
3. High Throughput: Offers high bandwidth and low latency, suitable for data center and enterprise applications.
4. QoS (Quality of Service): Implements traffic management to prioritize different types of traffic for optimal performance.
5. Multicast and Broadcast Support: Efficient handling of multicast traffic and broadcast filtering.
6. Energy Efficient: Designed for reduced power consumption and improved thermal performance.
7. Management Features: Supports various management protocols, including SNMP, RMON, and more.
This chipset is particularly suited for high-density environments requiring robust performance and scalability in networking infrastructure.

Package

The BCM56640B0IFSBLG is packaged in a 16mm x 16mm FCLGA (Fine-Pitch Ball Grid Array) format, which is designed for high-density applications and provides excellent thermal and electrical performance.

Pinout

The BCM56640B0IFSBLG is a high-performance switch chip from Broadcom, designed for use in data center and enterprise networking applications. It features a pin count of 352 pins. The primary functions of the BCM56640B0IFSBLG include supporting Layer 2 and Layer 3 switching, providing high bandwidth and low latency, and enabling advanced features such as Quality of Service (QoS), multicast, and security features. The chip supports various Ethernet standards, including 10GbE and 40GbE interfaces, making it suitable for modern networking requirements. Additionally, it integrates various management capabilities for efficient network operations.

Manufacturer

The BCM56640B0IFSBLG is manufactured by Broadcom Inc., a leading technology company. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. The company primarily serves various industries, including data centers, networking, broadband, wireless communications, and industrial markets. Their product offerings include networking chips, processors, and other integrated circuits that are integral to modern electronic systems and communication networks. Broadcom is known for its innovation and plays a significant role in enabling connectivity and high-performance data processing in various applications.

Application

The BCM56640B0IFSBLG is a network switch chip primarily used in data center, enterprise, and carrier-grade networking applications. It supports high-speed Ethernet connectivity and is designed for applications such as top-of-rack (ToR) switches, leaf-spine architectures, and software-defined networking (SDN) environments. Its features enable efficient packet processing, low latency, and high bandwidth, making it suitable for cloud services, virtualization, and large-scale data management.

Equivalent

The BCM56640B0IFSBLG chip is a Broadcom Ethernet switch. Equivalent products include the Marvell Prestera 98DX3240 series, the Intel FM6000 series, and the Microchip LAN9662. These alternatives offer similar features for networking and switching applications. Always check specifications for compatibility with specific requirements.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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