BCM56174B0KFSBG

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BCM56174B0KFSBG

16X10G OR 24X1G L3 SWITCH

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Vue d'ensemble

Description

The BCM56174B0KFSBG is a high-performance, multi-layer Ethernet switch from Broadcom, designed for data center and enterprise applications. This device typically supports Layer 2 and Layer 3 switching, enabling efficient data flow and management across network segments. It features advanced capabilities such as traffic management, Quality of Service (QoS), and support for various Ethernet speeds, including 10G and 25G.
The BCM56174B0KFSBG is optimized for scalability and low latency, making it suitable for demanding environments requiring rapid data processing. Its architecture often includes integrated features for security and network virtualization, facilitating seamless integration into modern network infrastructures.
Common applications for this switch include cloud computing, network storage, and high-density data center operations. The flexibility and efficiency of the BCM56174B0KFSBG contribute to enhanced network performance and reliability, catering to the needs of enterprise and service provider networks.

Features

The BCM56174B0KFSBG is a high-performance Ethernet switch chip from Broadcom, designed for data center and enterprise networking applications. Key features include:
- Ports: Supports 24 10/100/1000BASE-T ports and 4 SFP+ ports for 10GbE connectivity.
- Architecture: Based on a flexible packet processing architecture that enables Layer 2/3 switching and advanced features.
- Performance: Provides high bandwidth and low latency, suitable for high-throughput environments.
- Scalability: Supports various network topologies and can be integrated into larger systems or used in standalone configurations.
- QoS: Advanced Quality of Service (QoS) capabilities for traffic management.
- Power Efficiency: Designed for low power consumption, contributing to energy-efficient network operations.
- Management: Offers standard management interfaces for easy integration into network management systems.
This switch chip is ideal for applications requiring robust performance and flexibility in network design.

Package

The BCM56174B0KFSBG is packaged in a 16mm x 16mm FCLGA (Flip-Chip Land Grid Array) form factor. This package type provides a compact design suitable for high-density applications, enabling efficient thermal management and signal integrity for networking devices.

Pinout

The BCM56174B0KFSBG is a Broadcom Ethernet switch chip with a total of 48 pins. This device is part of the StrataXGS family and is designed for high-performance networking applications. It primarily serves as a Layer 2/Layer 3 switch and supports advanced features such as multi-layer switching, Quality of Service (QoS), and various Ethernet standards.
Key functions of the BCM56174 include support for multiple Ethernet ports, integrated MAC (Media Access Control) functionality, and various management interfaces. It is typically used in data center switches, enterprise networking equipment, and other high-bandwidth applications to provide efficient data traffic handling and improved network performance.
For specific pin functions, refer to the official Broadcom datasheet or technical documentation, as it provides detailed information about each pin's role and configuration options.

Manufacturer

The BCM56174B0KFSBG is manufactured by Broadcom Inc., a leading technology company headquartered in San Jose, California. Broadcom specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Their products are primarily used in networking, broadband, enterprise storage, and wireless communications. Broadcom's offerings include integrated circuits for various applications, including data center networking, telecommunications, and consumer electronics. The company is known for its innovation in the semiconductor industry and plays a crucial role in enabling modern connectivity solutions.

Application

The BCM56174B0KFSBG is a network switch chip commonly used in data center and enterprise networking applications. Its primary areas include high-performance data routing, IP networking, cloud computing, and Ethernet switching solutions. It supports various protocols and is designed for scalable network architectures, enabling efficient data management in environments requiring high bandwidth and low latency.

Equivalent

The BCM56174B0KFSBG chip, a Broadcom switch, has several equivalent products including the Marvell 88E6341, the Microchip KSZ9896, and the Intel I210 series. These alternatives offer similar functionalities in networking applications. However, it's essential to evaluate specific features and compatibility requirements for your application.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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