BCM5396IFBG

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BCM5396IFBG

16 PORT LAYER 2 GE SWITCH W/SE

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Spécifications

Package Tray
ProductStatus Obsolete

Vue d'ensemble

Description

The BCM5396IFBG is a networking chip produced by Broadcom, designed for use in various networking applications, including Ethernet switching and routing. It features a multi-core architecture, offering robust performance for both consumer and enterprise networking devices. The chip supports advanced features such as Quality of Service (QoS), VLAN tagging, and multicast filtering, catering to diverse data traffic management needs.
Additionally, the BCM5396IFBG is typically used in products like routers, switches, and wireless access points, providing high throughput and reliable connectivity. Its integration capabilities enable manufacturers to create compact and efficient networking solutions. The device often includes support for various protocols and standards, ensuring compatibility with existing network infrastructures. Overall, the BCM5396IFBG is popular for delivering high performance in demanding networking environments.

Features

The BCM5396IFBG is a highly integrated Ethernet switch from Broadcom, designed for enterprise and industrial applications. Key features include:
1. Ports: Typically offers 8 to 16 Gigabit Ethernet ports with optional SFP (Small Form-factor Pluggable) interfaces for flexibility in connectivity.
2. Performance: Supports a high switching capacity and line-rate forwarding for efficient data handling.
3. QoS: Implements advanced Quality of Service (QoS) features to prioritize traffic and ensure optimal performance for critical applications.
4. Power over Ethernet (PoE): Capable of delivering power to connected devices, simplifying cabling and installation.
5. Layer 2/Layer 3: Supports Layer 2 switching and Layer 3 routing features for versatile networking capabilities.
6. Security: Includes features like MAC address filtering and VLAN support for enhanced network security.
7. Management: Offers comprehensive management options, including SNMP (Simple Network Management Protocol) for easy integration into network management systems.
Overall, the BCM5396IFBG is designed for scalability, performance, and reliability in demanding networking environments.

Package

The BCM5396IFBG is packaged in a BGA (Ball Grid Array) format, specifically a 100-pin BGA package. This type of package allows for high pin density and improved thermal performance, making it suitable for networking and communication applications.

Pinout

The BCM5396IFBG is a Broadcom switch chip that typically comes in a 48-pin package. It is designed for use in various networking applications, including Ethernet switches.
The key functions of the BCM5396 include:
1. Switching: Provides Layer 2 switching capabilities, enabling data packet forwarding between connected devices.
2. Port Configuration: Supports multiple Gigabit Ethernet ports for high-speed data transfer.
3. VLAN Support: Allows for Virtual Local Area Network (VLAN) segmentation for improved network management.
4. QoS Features: Implements Quality of Service (QoS) to prioritize traffic for better performance.
5. Power Management: Supports energy-efficient operation to reduce power consumption in network devices.
In summary, the BCM5396IFBG is a versatile networking chip suited for high-performance Ethernet switching with various features for efficient network management.

Manufacturer

The BCM5396IFBG is manufactured by Broadcom Inc., a global technology company specializing in semiconductors and infrastructure software. Broadcom designs and develops a wide range of products, including Wi-Fi, Bluetooth, Ethernet, and broadband communications hardware. The company primarily serves markets such as data center, networking, software, broadband, and wireless communications. Broadcom is known for its innovations in networking solutions and plays a significant role in enabling high-performance connectivity and data transfer across various devices and systems.

Application

The BCM5396IFBG is primarily used in enterprise networking applications, including Ethernet switches, routers, and wireless access points. It supports advanced features such as Layer 2 and Layer 3 switching, quality of service (QoS), and multicast for efficient data handling. This device is suitable for data centers, telecommunication infrastructure, and service provider networks, enabling high-performance connectivity and management in complex network environments.

Equivalent

The BCM5396IFBG is a Broadcom switch chip. Equivalent products include the Marvell 88E6352, Realtek RTL8380, and Texas Instruments TLK10071. These alternatives offer similar functionalities for network switching applications, focusing on performance, port density, and power efficiency. However, specific features and compatibility should be verified for particular use cases.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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