BCM43570KFFBG

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BCM43570KFFBG

IC RF TXRX+MCU BLE 242FCBGA

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  • Mfr. Partie #BCM43570KFFBG
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  • En stock20065

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Spécifications

Part Status Active
Type TxRx + MCU
RF Family/Standard Bluetooth, WiFi
Protocol 802.11ac, Bluetooth v4.1 +EDR
Modulation 16QAM, 64QAM, 256QAM, 4DQPSK, 8DPSK, GFSK
Frequency 2.4GHz, 5GHz
Data Rate (Max) 867Mbps
Power - Output 20dBm
Sensitivity -99dBm
Memory Size 668kB ROM, 200KB RAM
Serial Interfaces HCI, I2S, JTAG, PCM, SDIO, SPI, UART, USB
Voltage - Supply 1.14V ~ 3.63V
Current - Receiving 79mA ~ 110mA
Current - Transmitting 250mA ~ 620mA
Operating Temperature 0°C ~ 60°C (TA)
Mounting Type Surface Mount
Package / Case 242-TFBGA, FCBGA
Supplier Device Package 242-FCBGA (10x10)
DigiKey Programmable Not Verified
GPIO 16

Vue d'ensemble

Description

The BCM43570KFFBG is a wireless communication chip produced by Broadcom, designed for integration into various devices like smartphones, tablets, and IoT applications. This chip supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth, utilizing the 802.11ac standard for high-speed wireless connectivity. It features advanced capabilities such as MU-MIMO (Multi-User Multiple Input Multiple Output) for improved performance in environments with multiple devices and supports various protocols for enhanced connectivity options.
The BCM43570KFFBG is built on a compact package, which allows for efficient space utilization in mobile devices while delivering robust performance. Its integration of Bluetooth alongside Wi-Fi capabilities makes it suitable for applications that require seamless wireless communication. The chip's energy-efficient design also helps extend battery life in portable devices. Overall, the BCM43570KFFBG is a versatile solution for manufacturers looking to enhance connectivity in their products.

Features

The BCM43570KFFBG is a highly integrated wireless communication chip by Broadcom, designed for high-performance connectivity in mobile and IoT applications. Key features include:
1. Dual-Band Wi-Fi: Supports 802.11ac with MIMO technology for enhanced speed and coverage in both 2.4GHz and 5GHz bands.
2. Bluetooth 5.0: Offers improved data transfer rates, extended range, and better performance in crowded environments.
3. Integrated Power Amplifiers and Low Noise Amplifiers: Optimizes power efficiency and signal quality.
4. Advanced Security: Supports WPA3 for enhanced security measures in wireless communications.
5. Compact Package: Designed in a small form factor, making it suitable for space-constrained devices.
6. Multi-stream Support: Facilitates simultaneous data streams, improving overall throughput.
This chip is ideal for smartphones, tablets, smart home devices, and other consumer electronics, providing robust connectivity solutions.

Package

The BCM43570KFFBG is packaged in a 12x12 mm QFN (Quad Flat No-lead) package. This compact form factor is designed for efficient thermal performance and space-saving in electronic applications.

Pinout

The BCM43570KFFBG is a wireless chip manufactured by Broadcom, featuring a total of 76 pins. This device integrates Wi-Fi 5 (802.11ac), Bluetooth 5.0, and FM radio functionalities. It is designed for use in various applications, including smartphones, tablets, and IoT devices.
Key functions of the BCM43570KFFBG include:
1. Wi-Fi: Supports dual-band (2.4 GHz and 5 GHz) connectivity with advanced features for improved performance and range.
2. Bluetooth: Provides low-energy Bluetooth support for peripherals and connectivity with various devices.
3. FM Radio: Integrated FM transmitter and receiver capabilities.
4. Multi-functional I/O: Supports various interfaces like SPI, I2C, and UART for external connectivity and expansion.
The chip is optimized for low power consumption and high data throughput, making it suitable for mobile and portable applications.

Manufacturer

The BCM43570KFFBG is manufactured by Broadcom Inc., a global technology company. Broadcom specializes in semiconductor and infrastructure software solutions. The company is known for its wide range of products, including networking, broadband, wireless communication, and storage solutions. Founded in 1991 and headquartered in San Jose, California, Broadcom serves various sectors, including telecommunications, data centers, and industrial applications. It is recognized as a leader in the semiconductor industry, driving innovations in connectivity and signal processing technologies.

Application

The BCM43570KFFBG is a Wi-Fi and Bluetooth combo chip designed for various applications, including smartphones, tablets, laptops, smart home devices, and automotive systems. It supports high-speed wireless connectivity, making it suitable for IoT devices, wearables, and other consumer electronics that require reliable communication and low power consumption.

Equivalent

The BCM43570KFFBG chip, a Wi-Fi and Bluetooth combo solution from Broadcom, has equivalent products such as the Qualcomm QCA9377, Intel Dual Band Wireless-AC 7260, and Realtek RTL8822CE. These alternatives provide similar functionalities in wireless connectivity for embedded systems and devices.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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