BCM43362KUBG

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BCM43362KUBG

IC RF TXRX+MCU WIFI 802.11

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  • Mfr. Partie #BCM43362KUBG
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Spécifications

Part Status Active
Type TxRx + MCU
RF Family/Standard WiFi
Protocol 802.11b/g/n
Modulation 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM
Frequency 2.4GHz
Data Rate (Max) 72Mbps
Power - Output 18.5dBm
Sensitivity -97dBm
Memory Size 448kB ROM, 240kB RAM
Serial Interfaces JTAG, SPI, UART
Voltage - Supply 1.2V ~ 3.3V
Current - Receiving 52mA ~ 59mA
Current - Transmitting 260mA ~ 320mA
Operating Temperature -30°C ~ 85°C
DigiKey Programmable Not Verified
GPIO 5

Vue d'ensemble

Description

The BCM43362KUBG is a highly integrated system-on-chip (SoC) designed by Broadcom for wireless communication applications. It combines Wi-Fi, Bluetooth, and FM radio functionalities, making it suitable for a variety of devices, including smartphones, tablets, and Internet of Things (IoT) products.
Key features of the BCM43362KUBG include support for dual-band Wi-Fi (2.4GHz and 5GHz), enabling high-speed wireless connectivity, and Bluetooth 4.1 for low-energy applications. Its compact design facilitates easy integration into various hardware configurations, while its low power consumption extends battery life in portable devices.
The chip supports various communication protocols and security standards, ensuring robust performance in diverse networking environments. Overall, the BCM43362KUBG is ideal for developers looking to enhance wireless capabilities in their products while maintaining efficiency and reliability.

Features

The BCM43362KUBG is a highly integrated wireless chip from Broadcom that supports dual-band Wi-Fi and Bluetooth functionalities. Key features include:
1. Dual-Band Wi-Fi: Supports 802.11a/b/g/n standards, offering both 2.4 GHz and 5 GHz frequency bands for enhanced connectivity and performance.
2. Bluetooth: Supports Bluetooth 4.0, allowing for low-energy connections and compatibility with a wide range of devices.
3. Integrated RF: Includes an integrated RF front-end, reducing the need for external components and simplifying design.
4. High Throughput: Capable of delivering high data rates, suitable for streaming and high-bandwidth applications.
5. Low Power Consumption: Designed for power efficiency, making it ideal for mobile and embedded applications.
6. Compact Package: Offered in a small, compact package, facilitating easy integration into various devices.
This chip is commonly used in smartphones, tablets, and IoT devices, enhancing their wireless communication capabilities while maintaining operational efficiency.

Package

The BCM43362KUBG is packaged in a 28-pin QFN (Quad Flat No-lead) package, specifically designed for compact integration in wireless communication applications.

Pinout

The BCM43362KUBG is a highly integrated Wi-Fi and Bluetooth combo chip from Broadcom designed for mobile and embedded applications. It features a 68-pin QFN (Quad Flat No-lead) package.
The primary functions of the BCM43362KUBG include:
- 802.11b/g/n Wi-Fi: Supports various Wi-Fi standards for wireless networking.
- Bluetooth 4.0: Offers low-energy Bluetooth functionality for connecting peripherals.
- MAC and Baseband: Contains the Media Access Control (MAC) layer and baseband processing for both Wi-Fi and Bluetooth.
- RF Transceiver: Integrates RF transceiver capabilities for both Wi-Fi and Bluetooth operations.
- Power Management: Features power-saving modes to enhance battery life in mobile devices.
This combo chip is commonly used in smartphones, tablets, and other IoT devices, providing a compact solution for wireless connectivity.

Manufacturer

The BCM43362KUBG is manufactured by Broadcom Inc., a global technology company that specializes in semiconductor and infrastructure software solutions. Founded in 1991, Broadcom primarily focuses on designing and developing a wide range of products for various applications, including networking, broadband, enterprise storage, and wireless communications. The company is known for its innovations in connectivity technologies, including Wi-Fi, Bluetooth, and GPS. Broadcom serves diverse markets such as data centers, telecommunications, and consumer electronics, making it a key player in the semiconductor industry.

Application

The BCM43362KUBG is a versatile Wi-Fi and Bluetooth combo chip primarily used in mobile devices, IoT applications, and consumer electronics. It supports wireless communication in smartphones, tablets, smart home devices, wearables, and automotive systems, enabling connectivity for applications like streaming, data transfer, and smart device integration. Its compact design and energy efficiency make it ideal for battery-operated devices.

Equivalent

The BCM43362KUBG chip is a Wi-Fi and Bluetooth combo chip from Broadcom. Equivalent products include the Qualcomm QCA9377, Marvell Avastar 88W8897, and MediaTek MT7632. These alternatives also offer integrated Wi-Fi and Bluetooth capabilities for similar applications in mobile and embedded devices.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

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