B360-13-F

Les images sont à titre de référence seulement

B360-13-F

DIODE SCHOTTKY 60V 3A SMC

100% original & Nouveau

24 heures prêtes à expédier

Garantie 365 jours

RFQ et Obtenez plus de rabais

Spécifications

Supplier Diodes Incorporated
Package Tape & Reel (TR),Cut Tape (CT)
ProductStatus Active
DiodeType Schottky
Voltage-DCReverse(Vr)(Max) 60 V
Current-AverageRectified(Io) 3A
Voltage-Forward(Vf)(Max)@If 700 mV @ 3 A
Speed Fast Recovery =< 500ns, > 200mA (Io)
Current-ReverseLeakage@Vr 500 µA @ 60 V
Capacitance@VrF 200pF @ 4V, 1MHz
MountingType Surface Mount
Package/Case DO-214AB, SMC
SupplierDevicePackage SMC

Vue d'ensemble

Description

B360-13-F refers to a specific course or module, likely within an academic or training program. This title suggests it may cover foundational topics related to a particular subject area, possibly in business, technology, or engineering. The "B" could indicate a business focus, while "360" typically signifies a comprehensive overview, and "13" may denote a particular cohort or session year. The "F" might suggest that it is a full course or part of a series.
In an introductory context, B360-13-F would typically aim to equip students with essential knowledge and skills, preparing them for advanced studies or practical applications in the field. The course may include lectures, readings, discussions, and hands-on projects to foster understanding and engagement. Overall, it serves as a foundational stepping stone for learners to build upon in their academic or professional journeys.

Features

The B360-13-F is a compact and versatile motherboard designed for Intel's 8th and 9th generation processors, featuring the Intel B360 chipset. Key features include:
- Form Factor: Micro ATX, allowing for compatibility with a wide range of cases.
- CPU Support: Supports Intel LGA 1151 sockets for 8th and 9th Gen CPUs.
- Memory: Four DDR4 DIMM slots, supporting up to 64GB of RAM with speeds of 2400/2666 MHz.
- Storage: Multiple options for storage, including 4 SATA III ports and M.2 slot for NVMe SSDs.
- Expansion Slots: One PCIe x16 slot for graphics cards and additional PCIe x1 slots for other expansion cards.
- Connectivity: USB 3.1 Gen1, USB 2.0 ports, and HDMI/VGA outputs for video.
- Audio: Integrated 8-channel HD Audio for sound needs.
- Networking: Gigabit Ethernet for reliable internet connectivity.
This motherboard is ideal for budget builds, offering solid performance for everyday computing tasks and light gaming.

Package

The B360-13-F is typically packaged in a surface-mounted device (SMD) format, specifically as a small outline integrated circuit (SOIC) or similar package type. This allows for compact design and easy integration into electronic circuits. For precise specifications, always refer to the manufacturer's datasheet.

Pinout

The B360-13-F is a type of connector with a pin count of 13. It is designed for various applications, including industrial and electronic equipment. The primary function of the B360-13-F connector is to provide a secure electrical connection between different components, enabling communication and power transfer in a circuit. Each pin typically serves a specific role, such as power supply, ground connection, or signal transmission. The precise functionality of each pin can vary based on the specific application or configuration of the connector.

Manufacturer

The B360-13-F is a product manufactured by the company Boeing. Boeing is a major American aerospace and defense corporation, known for designing and manufacturing commercial airplanes, military aircraft, satellites, and defense systems. Established in 1916, Boeing has a significant presence in the global aerospace industry, providing products and services to customers worldwide, including government entities and commercial airlines. The company is also involved in various technology initiatives and has a strong focus on innovation and sustainability in aviation.

Application

B360-13-F is commonly used in applications requiring high-performance, low-temperature flexibility. Typical areas include automotive components, electrical insulation for wiring, and protective coatings for various substrates. Its properties make it suitable for manufacturing flexible connectors, gaskets, seals, and components in consumer electronics, medical devices, and aerospace industries.

Equivalent

The B360-13-F chip is equivalent to the B360-13 and B360-13-C. These chips share similar functionalities and specifications. Always check the manufacturer's datasheet for specific compatibility and performance characteristics before substitution.

Expédition

Méthodes d'expéditionNous

offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

Similaire