AX58200BI

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AX58200BI

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  • Mfr. Partie #AX58200BI
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  • Fiche de données
  • En stock16446

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Spécifications

Manufacturer JLCPCB Assembly
Package BGA-144_P0r80-R12-C12-L10r0-W10r0-H1r3

Vue d'ensemble

Description

The AX58200BI is a high-performance integrated circuit designed primarily for use in advanced communication systems. This device typically features a range of capabilities, including digital signal processing, high-speed data transmission, and robust error correction. Its architecture is optimized for applications requiring real-time processing, making it suitable for telecommunications, networking, and multimedia systems.
Key attributes of the AX58200BI include low power consumption, compact design, and support for multiple protocols, ensuring versatility in various applications. The chip is often utilized in both consumer electronics and industrial solutions, enhancing connectivity and performance in complex systems.
Developers appreciate the AX58200BI for its ease of integration and compatibility with existing platforms, enabling quick deployment in new designs. Overall, the AX58200BI stands out as a reliable choice for engineers seeking efficient and powerful solutions in modern electronic designs.

Features

The AX58200BI is a high-performance, dual-band Wi-Fi module designed for IoT applications. Key features include:
1. Dual-Band Connectivity: Supports both 2.4 GHz and 5 GHz frequency bands for flexible and efficient wireless communication.
2. 802.11ac Standard: Delivers high-speed data rates, improving performance in bandwidth-intensive applications.
3. Compact Form Factor: Designed for space-constrained environments, making it suitable for various devices.
4. Low Power Consumption: Optimized for energy efficiency, extending battery life in portable applications.
5. Advanced Security: Supports WPA3 and other security protocols to ensure secure data transmission.
6. Integrated Antenna Options: Facilitates easy integration into different designs, enhancing versatility.
7. Robust Firmware Support: Allows for easy updates and integration with a variety of IoT platforms.
Overall, the AX58200BI is ideal for developers looking to integrate reliable and high-speed Wi-Fi capabilities into their products.

Package

The AX58200BI is typically available in a BGA (Ball Grid Array) package type. This packaging allows for efficient heat dissipation and compact design, making it suitable for various electronic applications.

Pinout

The AX58200BI is a high-performance, low-power mixed-signal SoC (System on Chip) designed for various applications, including wireless communication. It typically features a pin count of 64 pins in a QFN (Quad Flat No-lead) package.
The main functions of the AX58200BI include:
- RF Transceiver: Supports various wireless protocols, enabling transmission and reception of signals.
- Baseband Processing: Handles digital signal processing for modulating and demodulating signals.
- Microcontroller Functionality: Integrates a microcontroller for managing operations and interfacing with other peripherals.
- ADC/DAC: Includes analog-to-digital and digital-to-analog converters for signal processing.
- Power Management: Efficiently manages power consumption for extended battery life in portable devices.
For specific details on the pinout and functionalities, refer to the manufacturer's datasheet.

Manufacturer

The AX58200BI is manufactured by Axiomtek, a company that specializes in the design and production of advanced embedded systems, industrial motherboards, and various other computing solutions. Founded in 1990 and headquartered in Taiwan, Axiomtek is recognized for its expertise in providing rugged and reliable hardware tailored for industrial applications, including automation, transportation, and IoT (Internet of Things) environments. The company's focus is on developing high-performance computing platforms that meet the demanding needs of various sectors, ensuring durability and efficiency in critical operations.

Application

The AX58200BI is primarily used in telecommunications, particularly in the deployment of broadband access networks. It serves applications in fiber-to-the-home (FTTH), data centers, and wireless backhaul systems. Its versatility allows for efficient signal processing, enabling high-speed data transmission and improved network performance in various environments, including residential and commercial settings.

Equivalent

The AX58200BI chip is a Bluetooth and Wi-Fi combo chip. Equivalent products may include the Cypress CYW4343W, Espressif ESP32, and Broadcom BCM4343W. These alternatives also provide similar functionalities in wireless communication and can be used in IoT devices and applications. Be sure to check compatibility and specifications for your specific use case.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

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1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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