AS4C128M16D2A-25BIN

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AS4C128M16D2A-25BIN

IC DRAM 2GBIT PARALLEL 84FBGA

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  • Mfr. Partie #AS4C128M16D2A-25BIN
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Spécifications

Part Status Active
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR2
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 400 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 84-TFBGA
Supplier Device Package 84-FBGA (10.5x13.5)
Base Product Number AS4C128

Vue d'ensemble

Description

The AS4C128M16D2A-25BIN is a 2Gb DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory) chip designed for high-performance applications. It features a 128M x 16 architecture, offering a total capacity of 2 gigabits. Operating at a speed of up to 25 nanoseconds (ns), it supports data transfer rates that enhance overall system performance.
This memory chip operates on a supply voltage of 1.5V, ensuring low power consumption, which is critical for battery-operated devices. The AS4C128M16D2A-25BIN is compatible with various memory controllers and can be used in applications ranging from consumer electronics to computing systems.
Key features include a seamless interface for integration, support for various access modes, and enhanced reliability through built-in error correction capabilities. Its compact design allows for easy incorporation into printed circuit boards (PCBs), making it a versatile choice for developers looking to boost memory performance in their products.

Features

The AS4C128M16D2A-25BIN is a high-performance DDR3 SDRAM memory chip. Key features include:
- Capacity: 128 Megabits (16 Megabytes x 8 bits).
- Organization: 16M x 8 bits, making it suitable for various applications.
- Speed: Operates at a frequency of 800 MHz with a data rate of 1600 MT/s.
- Access Time: Offers low latency access, enhancing performance in data-intensive tasks.
- Voltage: Operates at a low voltage of 1.5V, beneficial for power efficiency.
- Package: Available in a compact FBGA (Fine Ball Grid Array) package, facilitating integration into various devices.
- Features: Supports burst mode, self-refresh, and has multiple banks for improved multitasking and performance.
This memory chip is ideal for applications in mobile devices, networking, and consumer electronics, ensuring reliable and efficient data processing.

Package

The AS4C128M16D2A-25BIN is typically offered in a 78-ball TFBGA (Thin Fine Pitch Ball Grid Array) package. This compact package format is designed for high-density applications, providing efficient thermal performance and space-saving benefits.

Pinout

The AS4C128M16D2A-25BIN is a 128Mb (16MB) DDR3 SDRAM memory chip with a pin count of 78 pins, housed in a BGA (Ball Grid Array) package.
Function:
It operates at a clock speed of up to 800 MT/s and features a data bus width of 16 bits. The chip is designed for high-performance applications, offering low power consumption and support for various memory configurations. It has functions including burst read/write operations, which enhance data transfer rates, and supports multiple command modes such as read, write, and refresh cycles, making it suitable for various computing environments.

Manufacturer

The manufacturer of the AS4C128M16D2A-25BIN is Alliance Memory, Inc. Founded in 2006 and headquartered in San Carlos, California, Alliance Memory is a semiconductor company that specializes in providing a wide range of memory solutions, including DRAM, SRAM, and Flash memory products. The company focuses on supplying high-quality and reliable memory components for various applications, including consumer electronics, telecommunications, automotive, and industrial markets. Alliance Memory operates globally, catering to the needs of original equipment manufacturers (OEMs) and distributors, with a commitment to maintaining competitive pricing and supporting long-term product availability.

Application

The AS4C128M16D2A-25BIN is a 2Gb DDR3 SDRAM memory chip primarily used in consumer electronics, networking devices, and computing applications. Its application areas include smartphones, tablets, laptops, and desktop computers, as well as servers and embedded systems requiring high-speed memory storage for data-intensive tasks.

Equivalent

The AS4C128M16D2A-25BIN is a DDR3 SDRAM chip. Equivalent products include:
1. MT41K128M16HA-125
2. H5TQ2G83AFR
3. K4B4G1646F-BCK0
4. MTA4ATF51264HZ-2G2E1
Check specific datasheets for detailed compatibility and specifications.

Expédition

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offrir des services d'expédition mondiaux par DHL, FedEx, TNT, UPS ou tout autre expéditeur de votre choix.


Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

Payment Methods

Le terme de paiement est 100% prépayé.

Actuellement, nous n'acceptons que les méthodes de paiement ci-dessous:

1. PayPal

2. Carte de crédit/débit

3. Transfert bancaire

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