10AX016E4F27E3SG

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10AX016E4F27E3SG

IC FPGA 240 I/O 672FBGA

  • Fabricant
  • Mfr. Partie #10AX016E4F27E3SG
  • Paquet FBGA-672
  • Fiche de données
  • En stock2613

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Spécifications

Package Tray
Series Arria 10 GX
ProductStatus Active
NumberofLABs/CLBs 61510
NumberofLogicElements/Cells 160000
TotalRAMBits 10086400
NumberofI/O 240
Voltage-Supply 0.87V ~ 0.93V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 672-BBGA, FCBGA

Vue d'ensemble

Description

The code "10AX016E4F27E3SG" refers to a specific FPGA (Field-Programmable Gate Array) model from Intel's Arria 10 family. These FPGAs are designed for high-performance applications, offering a combination of logic density, DSP (Digital Signal Processing) capabilities, and high-speed transceivers.
Key features include:
- Logic Elements: Provides a large number of configurable logic blocks.
- DSP Blocks: Optimized for intensive computational tasks, enhancing performance in signal processing.
- Memory: Integrated memory resources for efficient data handling.
- Transceivers: Supports high-speed data communication, ideal for networking and storage applications.
- Power Efficiency: Designed for low power consumption while maintaining performance.
Common applications include telecommunications, automotive, industrial automation, and data centers. The model number can help identify specific configurations and features, such as memory size and packaging options.

Features

The 10AX016E4F27E3SG is a member of Intel's Agilex FPGA family, specifically designed for high-performance and efficiency applications. Key features include:
1. Architecture: Utilizes a 10nm process technology for improved power efficiency and performance.
2. Logic Elements: Contains 16,000 adaptive logic modules (ALMs) for flexible logic implementation.
3. DSP Blocks: Integrates digital signal processing (DSP) blocks optimized for high-speed arithmetic operations.
4. Memory: Features on-chip memory resources, including SRAM and configuration memories for enhanced data handling.
5. I/O Capabilities: Supports high-speed I/O interfaces, allowing for a range of connectivity options including PCIe and Ethernet.
6. AI Acceleration: Enhanced support for artificial intelligence (AI) workloads with dedicated hardware capabilities.
7. Reliability: Designed for robustness in critical applications, with features supporting fault tolerance and reliability.
These attributes make the 10AX016E4F27E3SG suitable for diverse applications such as data centers, telecommunications, and embedded systems.

Package

The package type of the 10AX016E4F27E3SG is a F31 package, specifically a 484-pin Ball Grid Array (BGA). This type is commonly used for high-performance FPGA devices, providing efficient thermal and electrical performance.

Pinout

The 10AX016E4F27E3SG is an FPGA (Field-Programmable Gate Array) from Intel's Agilex series. It features a pin count of 484 pins. The FPGA provides various functionalities, including logic processing, signal processing, and interface connections. It supports high-speed data processing and connectivity options, making it suitable for applications in communications, automotive, and industrial sectors. The specific configuration of pins includes general-purpose I/O, power supply pins, and dedicated pins for configuration and clock signals, among others.

Manufacturer

The manufacturer of the 10AX016E4F27E3SG is Intel Corporation. Intel is a multinational technology company based in the United States, primarily known for its semiconductor products, including microprocessors, integrated circuits, and other hardware components. Established in 1968, Intel is a leading developer of technology that powers computing devices and systems across various sectors, including personal computing, data centers, and the Internet of Things (IoT). The 10AX016E4F27E3SG is part of Intel's Arria 10 FPGA (Field-Programmable Gate Array) series, which is designed for applications requiring high performance and flexibility in digital design. Intel plays a significant role in driving innovation in the tech industry and is a key player in the global semiconductor market.

Application

The 10AX016E4F27E3SG is a FPGA (Field-Programmable Gate Array) from Intel's Agilex series. Its application areas include telecommunications, data centers, automotive systems, industrial automation, and aerospace/defense. It is utilized for tasks such as real-time data processing, video processing, machine learning acceleration, and hardware acceleration in various embedded systems.

Equivalent

The 10AX016E4F27E3SG chip is an Intel/Altera FPGA (Field Programmable Gate Array). Equivalent products include:
1. Xilinx Kintex-7 FPGA (e.g., XCKU035)
2. Lattice ECP5 FPGA (e.g., LFE5U-25)
3. Microsemi SmartFusion 2 (e.g., M2S010)
Ensure to check specific requirements like power, I/O count, and performance for precise compatibility.

Expédition

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Référence des frais d'expédition (DHL/FedEx):

DHL: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 2 à 5 jours ouvrables.

FedEx: Les frais d'expédition varient de 25 à 40 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

UPS: Les frais d'expédition vont de 25 à 45 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

TNT: Les frais d'expédition varient de 25 à 65 $ (0,5 kg), avec un délai de livraison estimé de 3 à 7 jours ouvrables.

EMS: Les frais d'expédition varient de 30 à 50 $ (0,5 kg), avec un délai de livraison estimé de 7 à 15 jours ouvrables.

Courrier aérien enregistré: Le coût d'expédition est de 2 à 4 $ (0,1 kg), avec un délai de livraison estimé de 5 à 20 jours ouvrables.

Paiements

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