BOM / RFQ
3
Connexion
BOM / RFQ
3
Connexion
Accueil
Produits
Les fabricants
RFQ
Hot
À propos
Langue
English
日本語
Deutsch
Français
Español
영어
Английский
Tiếng Anh
中文
Accueil
/
Paquet
/
12-CSDIP (0.457, 116mm) Window
12-CSDIP (0.457, 116mm) Window
Mfr. Partie#
Description
Fabricant
En stock
Opération
TC237
TC237
4193
+ Bom
TC237B
TC237B
2460
+ Bom
TC237H
TC237H
4841
+ Bom
Autre paquet
46-BGA, CSPBGA
6-DIP Module
80-XFBGA, WLCSP
36-DIP Module (0.610, 15.49mm)
0603 (1608 Metric)
10-VFDFN Exposed Pad
8-XFBGA, WLCSP
48-BSSOP (0.295", 7.50mm Width)
332-FBGA
SOD-923
TO-8 Style, 12 Leads
48-QFN
3-UDFN Exposed Pad
24-CDIP (0.300, 7.62mm)
2104-BBGA, FCBGA
Paquet chaud
8/MSOP
16 SOIC
100TQFP
PG-TO220-3
4SC70
1017-FBGA
µDFN-6
8 DFN
48-VFQFN Exposed Pad
8-SOIC (0.154, 3.90mm Width)
10-CLCC
100-LQFP
16-SOIC (0.154, 3.90mm Width)
10-CSOIC
SC-74A